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Mobile Phone 4G 5G Motherboards HDI Electronic Circuit Board Assembly

Topmatch Electronics (Suzhou) Co., Limited.

Mobile Phone 4G 5G Motherboards HDI Electronic Circuit Board Assembly

Brand Name : TOPCBS

Model Number : Mobile Phone motherboard

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20units per package box size 20*15*10cm

HDI PCB Standards : IPC-A-610 D

Board thickness : 0.7mm

HDI Board Product name : HDI pcb board

Line width/space : 50um/50um

Soldermask : Black

Laser size : 75um

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OEM Electronic Pcb Board Assembly HDI Pcba Manufacturer

PCB geometry also plays a fundamental role, where geometry means laminate thickness and transmission line characteristics. With regard to the first point, it is necessary to choose a laminate thickness which is typically between 1/4 and 1/8 of highest operating frequency’s wavelength. If the laminate is too thin, there is a risk of it resonating, or even propagating the waves through the conductors. With regard to transmission lines, it is necessary to decide which type of conductor you want to use: microstrip, stripline, or grounded coplanar waveguide (GCPW). Microstrips are probably the most familiar ones, but they have problems with radiated losses and spurious mode propagation above 30 GHz. Striplines are a valid solution, too, but they are difficult to manufacture and therefore more expensive. In addition, microvias must be used to connect the striplines to the outermost layers. GCPWs are an excellent choice but they offer higher conduction losses than microstrips and striplines.

1. Product application

Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.

2 . Specifications:

Name 10Layer anylayer HDI PCB for 5G mobile phone motherboard
Layer 10
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material EM370
Min Track/Spacing 75um/100um
Drilling Size 100um
Solder Mask Green
Silkscreen White
Surface Finish Immersion gold
Finished Copper 1/3OZ
Production time 10-21 working days
Lead time 2-3 days

PCBs for high frequency applications require to be subjected to automatic inspection procedures, both optical (AOI) or performed through ATE. These procedures allow to enormously increase the quality of the product, highlighting possible errors or inefficiencies of the circuit. The recent progress made in the field of automatic inspection and testing of PCBs has led to significant time savings and reduced costs associated with manual verification and testing. The use of new automated inspection techniques will help overcome the challenges imposed by 5G, including global impedance control in high frequency systems. Increased adoption of automated inspection methods also allows for consistent performance with high production rates.


Product Tags:

4G 5G Motherboards

      

mobile phone 5G Motherboards

      

5ghz motherboard

      
Quality Mobile Phone 4G 5G Motherboards HDI Electronic Circuit Board Assembly for sale

Mobile Phone 4G 5G Motherboards HDI Electronic Circuit Board Assembly Images

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