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Oem EM528K Assembly Pcb Assembly Smt Circuit Board

Topmatch Electronics (Suzhou) Co., Limited.

Oem EM528K Assembly Pcb Assembly Smt Circuit Board

Brand Name : TOPCBS

Model Number : 1.0mm thermal bar 12 Anylayer HDI / Optical module board

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20unit per package package size:20*15*10cm

Name : 1.0mm thermal bar board / 12 Anylayer HDI / Optical module board

Drilling Size : 200um

Raw material : EM528K

Layer count : 12Layer

Board Thickness : 1.0mm

Stack up : Anylayer

Finish treatment : ENEPIG

Line width/space : 50um / 60um

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Oem Assembly Pcb Assembly Smt Circuit Board ​


A well designed circuit board means:
· A reduction in production problems
· Improved quality control
· Reduced costs
· Reduced manufacturing times


1 . Descriptions:

What is a HDI PCB?


HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.


Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.


Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.


2 . Specifications:

ItemSpecification
1Numbr of Layer1-18Layers
2MaterialFR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
3Surface FinishHASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
4Finish Board Thickness0.2mm-6.00 mm(8mil-126mil)
5Copper Thickness1/2 oz min;12 oz max
6Solder MaskGreen/Black/White/Red/Blue/Yellow
7Min.Trace Width & Line Spacing0.075mm/0.1mm(3mil/4mil)
8Min.Hole Diameter for CNC Driling0.1mm(4mil)
9Min.Hole Diameter for punching0.9mm(35mil)
10Biggest panel size610mm*508mm
11Hole Positon+/-0.075mm(3mil) CNC Driling
12Conductor Width(W)

0.05mm(2mil)or;

+/-20% of original artwork

13Hole Diameter(H)

PTH L:+/-0.075mm(3mil);

Non-PTH L:+/-0.05mm(2mil)

14Outline Tolerance

0.125mm(5mil) CNC Routing;

+/-0.15mm(6mil) by Punching

15Warp & Twist0.70%
16Insulation Resistance10Kohm-20Mohm
17Conductivity<50ohm
18Test Voltage10-300V
19Panel Size110×100mm(min);660×600mm(max)
20Layer-layer misregistration

4 layers:0.15mm(6mil)max;

6 layers:0.25mm(10mil)max

21Min.spacing between hole edge to circuity pqttern of an inner layer0.25mm(10mil)
22Min.spacing between board oulineto circuitry pattern of an inner layer0.25mm(10mil)
23Board thickness tolerance

4 layers:+/-0.13mm(5mil);

6 layers:+/-0.15mm(6mil)

24Impedance Control+/-10%
25Different Impendance+-/10%

3. Advantages:


The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.




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