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12um 1+N+1 High Density Interconnect Pcbs Glass Fiber

Topmatch Electronics (Suzhou) Co., Limited.

12um 1+N+1 High Density Interconnect Pcbs Glass Fiber

Brand Name : TOPCBS

Model Number : 1.0mm thermal bar 12 Anylayer HDI / Optical module board

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20unit per package package size:20*15*10cm

Name : 1.0mm thermal bar board / 12 Anylayer HDI / Optical module board

Drilling Size : 200um

Raw material : EM528K

Layer count : 12Layer

Board Thickness : 1.0mm

Stack up : Anylayer

Testing Service : Fly-probe,100% AOI testing, 100% ET testing,100% FQC

Line width/space : 50um / 60um

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OEM Making machine circuit board aluminum plain copper clad Flexible HDI SMT Assemble

HLD is an industrial grade IOT control board for wired communication. The main board uses the wired network to communicate with the cloud platform, and the switching analog of relay on the main board, AD simulated data collection, IC card data collection, UHF label card data collection, and 5V/12V power supply can be controlled by using this main board.

Its W5500 chip enables users to connect to the Internet in their applications by using a single chip(TCP/IP Stack, 10/100 Ethernet MAC, and PHY embedded). It also has three RS232 ports to fulfill the need for communication peripherals via serial ports.

The following files are required for PCB design:
1: DSN/SCH format Schematic diagram
2: PCB footprint
3: Package library file/main devices datasheet
4: Outline structure drawing/DXF format/DWG format
5:Layout/wiring/timing/frequency/speed/current and other electrical design requirements
6: Reference board/PCB or BRD format

2 . Specifications:

Min.Hole Size
Min.Line Spacing
Green or as your request
Layer Number
2 Layers
Board Thickness
Surface Finishing
HASL Lead Free
vaccum package

3. Advantages:

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

Product Tags:



Interconnect HDI PCB


12um hdi multilayer pcb

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