Multilayer Hdi Pcb Hard Gold Plating Used For Industrial Control
- Cost-effectiveness: when properly planned out, overall costs are
reduced due to the lower number of necessary layers and smaller
sizes/fewer number of needed boards when compared to standard PCBs.
- Faster time-to-market: Design efficiencies in HDI PCB production
mean faster time-to-market. Because of the easy placement of
components and vias and electrical performance, it takes a shorter
amount of time to go through the design and testing process for HDI
- Better reliability: Microvias have much better reliability than
typical through holes due to the use of a smaller aspect ratio;
they are more dependable than through holes, granting HDIs
outstanding performance with better materials and parts.
1 . Descriptions:
What is an HDI PCB?
HDI stands for High Density Interconnector. A circuit board which
has a higher wiring density per unit area as opposed to
conventional board is called as HDI PCB. HDI PCBs have finer spaces
and lines, minor vias and capture pads and higher connection pad
density. It is helpful in enhancing electrical performance and
reduction in weight and size of the equipment. HDI PCB is the
better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board
should have various features i.e. high-frequency transmission
capability, impedance control, decreases redundant radiation, etc.
The board should be enhanced in the density because of the
miniaturization and arrays of the electronic parts. In addition, to
the result of the assembling techniques of leadless, fine pitch
package and direct chip bonding, the board is even featured with
Innumerable benefits are associated with HDI PCB, like high speed,
small size and high frequency. It is the primary part of portable
computers, personal computers, and mobile phones. Currently, HDI
PCB is extensively used in other end user products i.e. as MP3
players and game consoles, etc.
2 . Specifications:
|Name||1.0mm flexible 12 Anylayer HDI / Optical module board|
|Number of Layers||12|
|Quality Grade||IPC 6012 Class 2,IPC 6012 Class 3|
|Min Hole Size||Laser 75um; Drilling size 200um|
|Production time||10-21 working days|
|Lead time||2-3 days|
The most common reason for using HDI technology is a significant
increase in packaging density. The space obtained by finer track
structures is available for components. Besides, overall space
requirements are reduced will result in smaller board sizes and
Usually FPGA or BGA are available with 1mm or less spacing. HDI
technology makes routing and connection easy, especially when
routing between pins.