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Multilayer Hdi Pcb Hard Gold Plating Used For Industrial Control

Topmatch Electronics (Suzhou) Co., Limited.

Multilayer Hdi Pcb Hard Gold Plating Used For Industrial Control

Brand Name : TOPCBS

Model Number : 1.0mm flexible 12 Anylayer HDI / Optical module board

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20unit per package package size:20*15*10cm

Name : 1.0mm flexible 12 Anylayer HDI / Optical module board

Drilling Size : 200um

Copper Thickness : 1oz

Layer count : 12Layer

Board Thickness : 1.0mm

Stack up : Anylayer

Min. Line Spacing : 0.1mm

Line width/space : 50um / 60um

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Multilayer Hdi Pcb Hard Gold Plating Used For Industrial Control

  • Cost-effectiveness: when properly planned out, overall costs are reduced due to the lower number of necessary layers and smaller sizes/fewer number of needed boards when compared to standard PCBs.
  • Faster time-to-market: Design efficiencies in HDI PCB production mean faster time-to-market. Because of the easy placement of components and vias and electrical performance, it takes a shorter amount of time to go through the design and testing process for HDI PCBs.
  • Better reliability: Microvias have much better reliability than typical through holes due to the use of a smaller aspect ratio; they are more dependable than through holes, granting HDIs outstanding performance with better materials and parts.

1 . Descriptions:

What is an HDI PCB?

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.


Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.


Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.


2 . Specifications:

Name1.0mm flexible 12 Anylayer HDI / Optical module board
Number of Layers12
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialEM528K
Thickness1.0mm
Min Track/Spacing50um/60um
Min Hole SizeLaser 75um; Drilling size 200um
Solder MaskBlue
SilkscreenWhite
Surface FinishENEPIG
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

3. Advantages:

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.




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