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UL94V0 DDR4 Gold Metal Core PCB Board 10 Layer

Topmatch Electronics (Suzhou) Co., Limited.

UL94V0 DDR4 Gold Metal Core PCB Board 10 Layer

Brand Name : TOPCBS

Model Number : DDR Socket PCB

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20unit per package package size:20*15*10cm

Name : DDR Socket PCB

Layer count : 10Layer

Board Thickness : 2.0mm

Vias : Blind vias,Buried vias,Fill Cu vias

Stack up : 10L anylayer ,4-2-4

Finish treatment : Immersion gold

Unit size : 23.6*23.6mm(L*W)

Pitch size : 0.5P,0.4P,0.35P,0.3P

Surface treatment : Immersion gold

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2.0mm DDR3,DDR4,LPDDR5 Socket Interposer PCBs,4-2-4 Layer stack up


1 . Descriptions:


What is the PCB Layout Changes Needed for DDR4 Implementation?


DDR4 or Double Data Rate 4 comes in two distinct module types. So-DIMM or small outline dual in-line memory modules (260-pins) that are in use in portable computing devices like laptops. The other module type is DIMM or dual in-line memory modules (288-pins) that are in use in devices like desktops and servers.

So, the first change in architecture is, of course, due to the pin count. The previous iteration (DDR3) uses 240-pins for a DIMM and 204-pins for a So-DIMM. Whereas the previously mentioned, DDR4 uses 288-pins for its DIMM application. With the increase in pins or contacts, DDR4 offers higher DIMM capacities, enhanced data integrity, faster download speed, and an increase in power efficiency.


Accompanying this overall improvement in performance is also a curved design (bottom) that enables better, more secure attachment, and it improves stability and strength during installation. Also, there are bench tests that confirm that DDR4 offers a 50% increase in performance and can achieve up to 3,200 MTs (Mega Transfers per Second).

Furthermore, it achieves these increases in performance in spite of using less power; 1.2 volts (per DIMM) instead of the 1.5 to 1.35-volt requirement of its predecessor. All of these changes mean that the PCB designers must reassess their design approach for the implementation of DDR4.


2 . Specifications:


Rigid RPCB Manufacturing Capability
Item
RPCB
HDI
minimum linewidth/linespacing
3MIL/3MIL(0.075mm)
2MIL/2MIL(0.05MM)
minimum hole diameter
6MIL(0.15MM)
6MIL(0.15MM)
minimum solder resist opening (single-side)
1.5MIL(0.0375MM)
1.2MIL(0.03MM)
minimum solder resist bridge
3MIL(0.075MM)
2.2MIL(0.055MM)
maximum aspect Ratio (thickness/hole diameter)
10:1
8:1
impedance control accuracy
+/-8%
+/-8%
finished thickness
0.3-3.2MM
0.2-3.2MM
maximum board size
630MM*620MM
620MM*544MM
maximum finished copper thickness
6OZ(210UM)
2OZ(70UM)
minimum board thickness
6MIL(0.15MM)
3MIL(0.076MM)
Surface treatment
HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag
Immersion Gold,OSP,selectiveimmersion gold,
carbon print
Min/max laser hole size
/
3MIL / 9.8MIL
laser hole size tolerance
/
10%



Product Tags:

DDR4 Metal Core PCB Board

      

UL94V0 Metal Core PCB Board

      

10 Layer Rigid RPCB Board

      
Quality UL94V0 DDR4 Gold Metal Core PCB Board 10 Layer for sale

UL94V0 DDR4 Gold Metal Core PCB Board 10 Layer Images

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