Electronic Customer Fr4 Pcb Manufacturer PCB Circuit Board HDI PCB
HDI boards, one of the fastest growing technologies in PCBs, are
now available at Epec. HDI Boards contain blind and/or buried vias
and often contain microvias of .006 or less in diameter. They have
a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from
surface to surface, with buried vias and through vias, two or more
HDI layer with through vias, passive substrate with no electrical
connection, coreless construction using layer pairs and alternate
constructions of coreless constructions using layer pairs.
FR4, CEM3, Rogers, High TG, High Frequency Board,Aluminum, Copper,
Finised inner/outer copper thickness
0.5-6oz, regular 1oz
Finished board thickness
Min through holes size
Max panel size
Min panel size
1-50U'', regular 30U''
White, Black, Green, Red, Blue, Yellow, etc
White, Black, etc.
Silk Screen Min Line Width
HASL, HASL lead free, ENIG, OSP, Immersion Gold, Immersion Tin,
Immersion Silver, Hard gold, Flash gold
Plugging vias capability
UL USA, UL Canada, ROHS, ISO13485, ISO9001, ISO14001, IATF 16949
The most common reason for using HDI technology is a significant
increase in packaging density. The space obtained by finer track
structures is available for components. Besides, overall space
requirements are reduced will result in smaller board sizes and
Usually FPGA or BGA are available with 1mm or less spacing. HDI
technology makes routing and connection easy, especially when
routing between pins.