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Multilayer Quick Term HDI Printed Circuit Board PCBA Rigid Flexible

Topmatch Electronics (Suzhou) Co., Limited.

Multilayer Quick Term HDI Printed Circuit Board PCBA Rigid Flexible

Brand Name : TOPCBS

Model Number : 1.0mm flexible 12 Anylayer HDI / Optical module board

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20unit per package package size:20*15*10cm

Name : 1.0mm flexible 12 Anylayer HDI / Optical module board

Drilling Size : 200um

Copper Thickness : 1oz

Layer count : 12Layer

Board Thickness : 1.0mm

Stack up : Anylayer

Min. Line Spacing : 0.1mm

Line width/space : 50um / 60um

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Multilayer HDI Quick Term Printed Circuit Board &PCBA Rigid Flexible PCB

As consumer demands change, so must technology. By using HDI technology, designers now have the option to place more components on both sides of the raw PCB. Multiple via processes, including via in pad and blind via technology, allow designers more PCB real estate to place components that are smaller even closer together. Decreased component size and pitch allow for more I/O in smaller geometries. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

High-density interconnect, or HDI, circuit boards are printed circuit boards with a higher wiring density per unit area than traditional printed circuit boards. In general, HDI PCBs are defined as PCBs with one or all of the following: microvias; blind and buried vias; built-up laminations and high signal performance considerations. Printed circuit board technology has been evolving with changing technology that calls for smaller and faster products. HDI boards are more compact and have smaller vias, pads, copper traces and spaces. As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs. Rather than using a few PCBs in a device, one HDI board can house the functionality of the previous boards used.


Technical Capacity
ltemRigid PCBFlexible PCBRigid-Flex PCB
Max Layer24L8L20L
Inner Layer Min Trace/Space3/3mil3/3mil3/3mil
Out Layer Min Trace/Space3/3mil3.5/4mil3.5/4mil
Inner Layer Max Copper6oz2oz6oz
Out Layer Max Copper6oz2oz3oz
Min Mechanical Driling0.15mm0.1mm0.15mm
Min Laser Drilling0.1mm0.1mm0.1mm
Max Aspect Ratio(Mechanical Driling)20:0110:0112:01
Max Aspect Ratio(Laser Drilling)1:01/1:01
Press Fit Hole Ttolerance±0.05mm±0.05mm±0.05mm
PTH Tolerance±0.075mm±0.075mm±0.075mm
NPTH Tolerance±0.05mm±0.05mm±0.05mm
Countersink Tolerance±0.15mm±0.15mm±0.15mm
Board Thickness0.4-8mm0.1-0.5mm0.4-3mm
Board Thickness Tolerance(<1.0mm)<>±0.1mm±0.05mm±0.1mm
Board Thickness Tolerance(≥1.0mm)±10%/±10%
Min Board Size10*10mm5*10mm10*10mm
Max Board Size620*1200mm480*540mm480*540mm
Contour Tolerance±0.1mm±0.05mm±0.1mm
Min BGA7mil7mil7mil
Min SMT7*10mil7*10mil7*10mil
Min Solder Mask Clearance1.5mil3mil1.5mil
Min Solder Mask Dam3mil8mil3mil
Min Legend Width/Height4/23mil4/23mil4/23mil
Strain Fillet Width/1.5±0.5mm1.5±0.5mm
Bow &Twist0.70%/0.70%

Our advantage:

A. Very competitive price
B. Fast lead time from 12 hours
C. Perfect service and good relation ship with customer
D. Good quality. Welcome all kinds OEM ODM PCB order!


The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

Product Tags:

Multilayer HDI Printed Circuit Board


PCBA HDI Printed Circuit Board


Quick Term PCBA Board

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