Socket Interposer LPDDR4 DDR4 High Density Interconnect Boards
0.075mm Laser Drilling
2.0mm HDI PCBs for LPDDR4 Socket Interposer stack up 4-2-4
HDI PCBs take advantage of the most recent technologies existing to
amplify the functionality of circuit boards by means of the similar
or little amounts of area. This development in board technology is
motivated by the tininess of parts and semiconductor packages that
assist superior characteristics in innovative new products like
touch screen tabs.
HDI PCBs are described by high-density features comprising of laser
micro-vias, high performance thin materials and fine lines. The
better density allows extra functions per unit area. These types of
multifaceted structures give the required routing resolution for
large pin-count chips which are used in mobile devices and other
high technology products.
The placement of the parts on the circuit board needs extra
precision than conservative board design due to miniature pads and
fine pitch of the circuitry on the circuit board. Leadless chips
require special soldering methods and additional steps in the
assembly and repair process.
The lesser weight and size of the HDI circuitry means the PCBs fit
into the little spaces and have a smaller amount of mass than
conservative PCB designs. The smaller weight and size even
signifies that there is lesser chance of harm from mechanical
DDR4 operates with double the speed of DDR3. DDR4 operates on low
operating voltage (1.2V) and higher transfer rate. The transfer
rate of DDR4 is 2133 ~ 3200MT/s. DDR4 adds four new bank groups
technology. Each bank group has the feature of a single-handed
operation. The DDR4 can process 4 data within a clock cycle, so
DDR4’s efficiency is better than DDR3. DDR4 has some additional
functions such as DBI (Data Bus Inversion), CRC (Cyclic Redundancy
Check) on data bus, and Command/Address parity. These functions can
enhance DDR4 memory’s signal integrity and improve the stability of
data transmission/access. Independent programming of individual
DRAMs on a DIMM allows better control of on-die termination.
2 . Specifications:
|Name||2.0mm LPDDR4 interposer PCBs|
|Number of Layers||4-2-4 Layers|
|Quality Grade||IPC 6012 Class 2,IPC 6012 Class 3|
|Material||Lead Free materials|
|Min Hole Size||0.075mm laser drilling|
|Surface Finish||Immersion gold|
|Lead time||28-35 days|
|Quick turn service||Yes|
1 . Descriptions:
What is the PCB Layout Changes Needed for DDR4 Implementation?
DDR4 or Double Data Rate 4 comes in two distinct module types.
So-DIMM or small outline dual in-line memory modules (260-pins)
that are in use in portable computing devices like laptops. The
other module type is DIMM or dual in-line memory modules (288-pins)
that are in use in devices like desktops and servers.
So, the first change in architecture is, of course, due to the pin
count. The previous iteration (DDR3) uses 240-pins for a DIMM and
204-pins for a So-DIMM. Whereas the previously mentioned, DDR4 uses
288-pins for its DIMM application. With the increase in pins or
contacts, DDR4 offers higher DIMM capacities, enhanced data
integrity, faster download speed, and an increase in power
Accompanying this overall improvement in performance is also a
curved design (bottom) that enables better, more secure attachment,
and it improves stability and strength during installation. Also,
there are bench tests that confirm that DDR4 offers a 50% increase
in performance and can achieve up to 3,200 MTs (Mega Transfers per
Furthermore, it achieves these increases in performance in spite of
using less power; 1.2 volts (per DIMM) instead of the 1.5 to
1.35-volt requirement of its predecessor. All of these changes mean
that the PCB designers must reassess their design approach for the
implementation of DDR4.
1. High-performance RK3399 CPU, equipped with Android/Linux systems
(Android7.1), and AnTuTu score exceeds 10W
2. Support multi-format video decoding; support HDMI (4K/60fps),
MIPI-DSI (2560x1600@60fps), EDP (2K@60fps), DP (4K x2K) display
screen; support multi-screen display and dual-screen differential
3. Support M.2 PCIE, and external SSD can be connected.
4. Support SDIO, expandable WIFI/BT and external TF card storage.
5. Integrated GMAC Ethernet controller, scalable Gigabit Ethernet.
6. Embedded audio CODEC chip, can be directly connected to
earphones and power amplifiers
7. Abundant peripheral interfaces: 2 x USB2.0 HOST, 2 x USB3.0 (can
be configured as two TYPE-C), 1 x SPDIF digital audio, 2 x SPI,
multiple UART and PWM, etc., which can meet a variety of
8. Ultra-small size, 60*55*1.3 sampling B to B (board-to-board
connection), ten-layer board process.