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Android Boards Teaching Integrated Machine PCB Circuit Boards

Topmatch Electronics (Suzhou) Co., Limited.

Android Boards Teaching Integrated Machine PCB Circuit Boards

Brand Name : TOPCBS

Model Number : DDR Socket PCB

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20unit per package package size:20*15*10cm

Name : DDR Socket PCB

Layer count : 10Layer

Board Thickness : 2.0mm

Vias : Blind vias,Buried vias,Fill Cu vias

Stack up : 10L anylayer ,4-2-4

Finish treatment : Immersion gold

Unit size : 23.6*23.6mm(L*W)

Pitch size : 0.5P,0.4P,0.35P,0.3P

Surface treatment : Immersion gold

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Android Boards Teaching Integrated Machine PCB Circuit Boards​


PCB layouts for DDR4 designs require careful planning to get the most out of your hardware. They must also meet the rigorous demands of today’s memory requirements. Several factors, including critical connections and space allocation, govern the initial design stages, as designers must satisfy design specifications and routing topologies for successful implementation.


1. Auto boot up when power supply

2. Can customize rooted system

3. Pre-install your app

4. Support rotated screen

5. Customize boot logo/animation

6. Support customize 4G sim card slot

7. Support customize GPS

8. Support sample order


2 . Specifications:

Name2.0mm DDR3,DDR4 interposer PCBs
Number of Layers4-2-4 Layers
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialLead Free materials
Thickness2.0mm
Min Track/Spacing3/3mil
Min Hole Size0.075mm laser drilling
Solder MaskGreen
SilkscreenWhite
Surface FinishImmersion gold
Finished Copper1OZ
Lead time28-35 days
Quick turn serviceYes

1 . Descriptions:


What is the PCB Layout Changes Needed for DDR4 Implementation?


DDR4 or Double Data Rate 4 comes in two distinct module types. So-DIMM or small outline dual in-line memory modules (260-pins) that are in use in portable computing devices like laptops. The other module type is DIMM or dual in-line memory modules (288-pins) that are in use in devices like desktops and servers.

So, the first change in architecture is, of course, due to the pin count. The previous iteration (DDR3) uses 240-pins for a DIMM and 204-pins for a So-DIMM. Whereas the previously mentioned, DDR4 uses 288-pins for its DIMM application. With the increase in pins or contacts, DDR4 offers higher DIMM capacities, enhanced data integrity, faster download speed, and an increase in power efficiency.


Accompanying this overall improvement in performance is also a curved design (bottom) that enables better, more secure attachment, and it improves stability and strength during installation. Also, there are bench tests that confirm that DDR4 offers a 50% increase in performance and can achieve up to 3,200 MTs (Mega Transfers per Second).

Furthermore, it achieves these increases in performance in spite of using less power; 1.2 volts (per DIMM) instead of the 1.5 to 1.35-volt requirement of its predecessor. All of these changes mean that the PCB designers must reassess their design approach for the implementation of DDR4.



Product Tags:

Integrated PCB Circuit Boards

      

Android PCB Circuit Boards

      

10 Layer DDR Socket PCB

      
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